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超高精度倒裝芯片貼片機(jī) CB-700

簡要描述:超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn):
? Ultra-low load, high-accuracy bonding
? Real-time control is possible in the low load range. As a result, bump height variation become minimized.

  • 產(chǎn)品型號(hào):
  • 廠商性質(zhì):生產(chǎn)廠家
  • 更新時(shí)間:2024-04-02
  • 訪  問  量:1326

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詳細(xì)介紹

CB700



功能:貼片應(yīng)用:倒裝焊


特點(diǎn):

• Ultra-low load, high-accuracy bonding

• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

• Supports ultrasonic bonding by exchanging tools

• Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder


Standard Item & Optional Items 

[Standard Items]

• Flip chip unit

• Constant heat stage

• ATC(Automatic ceramic tool change)

• Calibration

• Process management(logger/export to another PC)

• Automatic leveling mechanism

• ID Reading

<Optional Items>

• Eutectic head ( No heating)

• Eutectic purge jig

• Eutectic stage (52mm pulse heater)

• Transfer function( Flux, Paste)

• Dispenser unit (except dispenser)

• Die bonding

• Chip imaging camera

• Gel pack

• Ultrasonic bonding




超高精度倒裝芯片貼片機(jī) CB-700

項(xiàng)目

規(guī)格參數(shù)

芯片尺寸

0.3x0.3~30X30mm

基板尺寸(W X L)

200X200 mm 基板 或8英寸 晶圓

邦定力度

長負(fù)載范圍:0.049~4.9N     高負(fù)載范圍:4.9~1000N

貼片精度

  ±0.5[μm](3σ)

貼片平臺(tái)

恒溫加熱臺(tái)  RT ~ 250℃

設(shè)備尺寸

1320(W) X 2120(D) X 1815(H)mm

超高精度倒裝芯片貼片機(jī) CB-700

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