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精密倒裝芯片貼片機(jī) CB-610

簡要描述:芯片分選機(jī),精密倒裝芯片貼片機(jī) CB-610特點(diǎn):
Correspond to fine pitch of electrodes with mounting accuracy ± 1μm
Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement

  • 產(chǎn)品型號:
  • 廠商性質(zhì):生產(chǎn)廠家
  • 更新時間:2024-06-04
  • 訪  問  量:1387

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詳細(xì)介紹

精密倒裝芯片貼片機(jī) CB-610

芯片倒裝鍵合機(jī)

 

CB610

 

 

功能:貼片應(yīng)用:倒裝焊

 

特點(diǎn):

  •   Correspond to fine pitch of electrodes with mounting accuracy  ± 1μm

  •   Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement

  •   follows thermal variation of work and tools in real time

  •   Equipped with recipes for various bonding processes as standard

  •   Feedback of abnormalities by bonding log analysis

 

Standard Items & Optional Items

<Standard Items>

  • Flip chip unit

  • Constant heat stage

  • ATC( Automatic ceramic tool change )

  • Calibration

  • Process management (logger / export to another PC)

  • Automatic leveling mechanism

  •  

<Optional Items>

  • Eutectic head ( No heating )

  • Eutectic purge jig

  • Eutectic stage(□52mm pulse heater

  • Transfer function( Flux, Paste)

  • Dispenser unit( except dispenser)

  • Die bonding

  • Chip imaging camera

  • Gel pack

  • Ultrasonic bonding

  • ID Reading

 

 

項目

規(guī)格參數(shù)

芯片尺寸

1?20 毫米

基板尺寸(WXL)

5~100mm X 235mm

貼片平臺

恒溫加熱臺RT~ ~ 250℃

芯片貼裝精度

≤±1微米

低載荷壓力范圍

0.049~4.9N (5~500g)

高載荷壓力范圍

4.9~490N (0.5~50kg)

  

 設(shè)備尺寸 :1320(W)X 1800(D)X1780(H)mm

精密倒裝芯片貼片機(jī) CB-610

 

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